Análisis del comportamiento a fatiga de uniones adhesivas de acero recubierto

  1. Bermejo López, Raquel
Supervised by:
  1. Javier Oñoro López Director

Defence university: Universidad Politécnica de Madrid

Fecha de defensa: 22 January 2016

Committee:
  1. Carlos Ranninger Rodríguez Chair
  2. Antonio Portolés García Secretary
  3. María Natividad Antón Iglesias Committee member
  4. Cristina García Cabazón Committee member
  5. Francisco Javier Juanes Garcia Committee member

Type: Thesis

Abstract

Adhesives are well-known and have been used in many applications throughout history. At present, adhesion bonding technology of structural materials is experiencing an important growth. Scientific advances have enabled a better understanding of the phenomena of adhesion, as well as to improve and develop new polymeric formulations that increase the range of applications. On the other hand, the development of new materials and the need to save weight, especially in the transport sector, have promote the use of adhesive bonding in many applications previously reserved for other joining technologies such as welded or mechanical joints, presenting similar or even higher performances. Adhesive bonding offers many advantages over other joining methods. For example, in the aeronautic industry and in the automation sector, adhesive bonding allows a reduction in the number of components (such as bolts, rivets, clamps) and as consequence, resulting in lighter designs and a decrease in handling and storage costs, as well as faster assembly processes and an improvement in the production processes. In the construction sector and in the industrial equipment manufacturing, the ability to withstand thermal expansion and contraction is required. Therefore, adhesion bonding technology is used to avoid any distortion of the substrate since this technology does not require heating nor the deformation of the pieces when these are exposed to very high and localized heating, as in welding, or when are subjected to localized mechanical stresses in the case of riveted joints. In the naval industry, repair techniques based in the adhesive bonding are being developed in order to distribute stresses more uniform and homogeneously in order to improve the performance against fatigue and to avoid the problems associated with standard repair techniques as cutting and welding. Adhesive bonding does not require the use of high temperatures and as consequence they do not produce undesirable microstructural changes, as it can be observed in molten zones or in heat-affected zones in the case of welding, neither is there damage of the protective coating of metals with low melting points or polymeric films. However, adhesive bonding presents a disadvantage that limits its application, the low long-term durability. The most common cause of fractures of materials is fatigue fracture. This failure process is the cause of 85% of the fracture of structural materials in service. Fatigue failure occurs when the materials are subjected to the action of cyclic loads or vibrations for a long period of time. The joints and structures subjected to fatigue can fail at stress values below the static strength of the material. Fatigue failure do not occurs by a static and homogeneous process of initiation and propagation of crack. The fatigue process gradually weakens the bond until the moment in which the fracture occurs very rapidly. Underhill explains this mechanism as a process of irreversible damage of the weakest links at certain points of the bonding. When the deterioration in these weaker zones occurs, their area increase until the damage zone is so extensive that the full failure of the joint occurs. During the crack growth tests performed on precracked double-cantilever beam specimen, (DCB), Dessureault identified the processes of crack initiation and growth in samples bonded with epoxy adhesive as a process of accumulation of microcracks on the zone near the crack bottom, then, they coalesced to configure the main crack. This is a damage process of the adhesive in the zone of high stress concentration that leads to failure of the bond.