A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

  1. Vallepuga-Espinosa, J.
  2. Ubero-Martínez, I.
  3. Rodríguez-Tembleque, L.
  4. Cifuentes-Rodríguez, J.
Journal:
Engineering Analysis with Boundary Elements

ISSN: 0955-7997

Year of publication: 2020

Volume: 115

Pages: 28-39

Type: Article

DOI: 10.1016/J.ENGANABOUND.2020.02.011 GOOGLE SCHOLAR

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