Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

1. Soares, D.
2. Vilarinho, C.
3. Silva, R. F.
4. Barbosa, J.
5. Castro Ruiz, Francisco

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DOI: 10.3989/REVMETALM.2005.V41.IEXTRA.1026 DIALNET GOOGLE SCHOLAR lock_openOpen access editor

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