Packaging-induced stress distribution in high power A1GaAs laser diodes by photoluminescence mapping

  1. Martin, P.
  2. Landesman, J.-P.
  3. Bisaro, R.
  4. Martin, E.
  5. Fily, A.
  6. Hirtz, J.P.
Revista:
Materials Science and Engineering B: Solid-State Materials for Advanced Technology

ISSN: 0921-5107

Any de publicació: 2001

Volum: 80

Número: 1-3

Pàgines: 188-192

Tipus: Article

DOI: 10.1016/S0921-5107(00)00627-9 GOOGLE SCHOLAR