Carrot and Stick approaches revisited when managing Technical Debt in an educational context
- Crespo, Y.
- Gonzalez-Escribano, A.
- Piattini, M.
Actas:
Proceedings - 2021 IEEE/ACM International Conference on Technical Debt, TechDebt 2021
ISBN: 9781665414050
Ano de publicación: 2021
Páxinas: 99-108
Tipo: Achega congreso